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      Manufacturing

       0.11 Ultra-low Leakage

       

       Overview

      CSMC 0.11 ULL process uses aluminum interconnects, 1P8M architecture, offering 1.5V core device and 3.3V I/O device with ultra-low-leakage features, typical Ioff (pA/um)<0.5.

       Key Features 
      - Single poly, eight-metal-layer process
      - Al backend with low-K FSG material
      - Device Ioff (typical) <0.5 pA/um

       Applications
      - MCU
      - IOT


       

       0.11 ULL flash 

       Overview

      CSMC 0.11 ULL flash process technology is embedded flash based on 0.11 ULL, core device is compatible with ULL process, offering ultra-low power analog IP.

       Key Features
      - Double poly, eight-metal-layer process
      - Al backend with low-K FSG material
      - Competitive flash macro cell size

       Application 
      - MCU
      - IOT